The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2018

Filed:

Dec. 10, 2015
Applicants:

Rahul Panat, Pullman, WA (US);

Deuk Hyoun Heo, Pullman, WA (US);

Inventors:

Rahul Panat, Pullman, WA (US);

Deuk Hyoun Heo, Pullman, WA (US);

Assignee:

WASHINGTON STATE UNIVERSITY, Pullman, WA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 11/00 (2006.01); B22F 3/105 (2006.01); B22F 1/00 (2006.01); G06F 1/16 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01F 41/02 (2006.01); H01F 41/04 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/14 (2006.01); H05K 3/22 (2006.01); H05K 3/46 (2006.01); B22F 7/08 (2006.01); B29C 70/88 (2006.01); B33Y 80/00 (2015.01); H05K 1/09 (2006.01); B33Y 10/00 (2015.01); B33Y 50/02 (2015.01); H01G 4/12 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
B22F 3/1055 (2013.01); B22F 1/0044 (2013.01); B22F 7/08 (2013.01); B29C 70/882 (2013.01); B33Y 80/00 (2014.12); G06F 1/163 (2013.01); H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H01F 41/0206 (2013.01); H01F 41/046 (2013.01); H01P 11/001 (2013.01); H05K 1/028 (2013.01); H05K 1/0283 (2013.01); H05K 1/0296 (2013.01); H05K 1/0313 (2013.01); H05K 1/0393 (2013.01); H05K 1/09 (2013.01); H05K 3/14 (2013.01); H05K 3/22 (2013.01); H05K 3/4644 (2013.01); B22F 2003/1058 (2013.01); B22F 2999/00 (2013.01); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12); H01G 4/1218 (2013.01); H05K 1/0284 (2013.01); H05K 1/097 (2013.01); H05K 3/1241 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/10098 (2013.01); H05K 2203/0126 (2013.01); Y10T 29/49016 (2015.01); Y10T 29/49124 (2015.01); Y10T 29/49155 (2015.01);
Abstract

Novel methods for micro-additive manufacturing three dimensional sub-millimeter components are disclosed herein. The methods can include dispensing a dielectric at positions on a substrate so as to provide dielectric structures having an aspect ratio of up to 1:20. The methods can also include in-situ curing of the dielectric structure upon dispensing of the dielectric wherein the dispensing and curing steps provide for three dimensional configurations. Direct printing a metal nanoparticle solution on the dielectric to create conductive traces and thereafter sintering the printed nanoparticle solution so as to cure the conductive traces enables three dimensional conductive (antenna) elements having a length and width scale of down to 1 μm.


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