The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2018
Filed:
Aug. 28, 2015
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Kanechika Kiyose, Nagano, JP;
Nobuaki Hashimoto, Nagano, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 8/00 (2006.01); A61B 8/08 (2006.01); G01N 29/24 (2006.01); G01N 29/34 (2006.01); G01S 15/89 (2006.01); G01S 7/52 (2006.01); B06B 1/06 (2006.01);
U.S. Cl.
CPC ...
A61B 8/4494 (2013.01); A61B 8/4427 (2013.01); A61B 8/4444 (2013.01); B06B 1/067 (2013.01); B06B 1/0629 (2013.01); G01S 7/52079 (2013.01); G01S 15/8925 (2013.01);
Abstract
An ultrasonic device includes an element substrate and a wiring substrate. The element substrate includes an ultrasonic element and an element interconnect terminal connected to the ultrasonic element. The wiring substrate includes a wiring terminal and an opening portion that defines an opening extending through the wiring substrate. The element interconnect terminal and the wiring terminal are connected so as to oppose each other. The opening portion encloses the ultrasonic element in plan view as seen from a thickness direction of the wiring substrate.