The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2018
Filed:
May. 24, 2017
Adlink Technology Inc., New Taipei, TW;
Chia-Te Yu, New Taipei, TW;
ADLINK TECHNOLOGY INC., New Taipei, TW;
Abstract
A thermal conducting structure applied to a network control automation system includes a circuit module and a heat dissipation structure. Copper foil layers are horizontally disposed on bare copper regions disposed at top and bottom sides of circuit board. An outer shell member includes side panels disposed at top and bottom sides, and each side panel defines a track member comprising a sliding edge. The copper foil layers can be slidably mounted along sliding edges, and outer shell member is pushed to inwardly move relative to circuit board, then circuit board is positioned in accommodation open chamber formed between outer shell member and two side panels. While assembling, copper foil layers are abutted and mounted with sliding slots, forming thermal conducting path. Heat generated by heat source can be conducted to heat dissipation structure through two copper foil layers, to increase heat dissipation area and improve heat dissipation efficiency.