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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10085346 B1

PDFFull Text
Date of Patent:
Sep. 25, 2018

Filed:

Aug. 04, 2016

Method for producing conductive member, and conductive member

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Kenichi Yamamoto, Ashigara-kami-gun, JP;

Naoharu Kiyoto, Ashigara-kami-gun, JP;

Kenji Naoi, Ashigara-kami-gun, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

John A McPherson

Int. Cl.
CPC ...
G06F 3/044 (2006.01); H05K 3/06 (2006.01); B32B 15/01 (2006.01); G03C 1/46 (2006.01); G03C 1/83 (2006.01); G03C 1/85 (2006.01); G06F 3/041 (2006.01); B32B 27/36 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); H03K 17/96 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); G03F 7/095 (2006.01); H05K 3/10 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/06 (2013.01); B32B 15/01 (2013.01); B32B 27/36 (2013.01); G03C 1/46 (2013.01); G03C 1/832 (2013.01); G03C 1/853 (2013.01); G03F 7/0952 (2013.01); G03F 7/203 (2013.01); G03F 7/2022 (2013.01); G03F 7/2032 (2013.01); G03F 7/32 (2013.01); G06F 3/041 (2013.01); G06F 3/044 (2013.01); H03K 17/96 (2013.01); H05K 1/0298 (2013.01); H05K 1/09 (2013.01); H05K 3/106 (2013.01); B32B 2307/202 (2013.01); B32B 2307/412 (2013.01); G06F 2203/04103 (2013.01); H05K 1/0274 (2013.01); H05K 3/4685 (2013.01); H05K 2203/125 (2013.01); H05K 2203/1476 (2013.01); H05K 2203/1581 (2013.01);
Abstract

Provided is a method for producing a conductive member including: forming a first silver halide emulsion layer, a light absorption layer, and a second silver halide emulsion layer on a transparent support in this order; performing pattern exposure on the first silver halide emulsion layer; and the second silver halide emulsion layer and applying a development treatment thereto to obtain a conductive layer comprising a thin metal wire, in which the light absorption layer absorbs at least some of the wavelengths of light to which the first silver halide emulsion layer or the second silver halide emulsion layer is exposed.

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