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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10085344 B1

PDFFull Text
Date of Patent:
Sep. 25, 2018

Filed:

Mar. 30, 2017

Electronic component and electronic component built-in board

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Masaki Hirota, Nagaokakyo, JP;

Yoshikazu Sasaoka, Nagaokakyo, JP;

Yasunori Taseda, Nagaokakyo, JP;

Shinichiro Kuroiwa, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Timothy Thompson

Assistant Examiner:

Guillermo Egoavil

Int. Cl.
CPC ...
H01G 4/06 (2006.01); H05K 1/18 (2006.01); H01G 4/012 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01); H01L 41/187 (2006.01); H01L 41/047 (2006.01); H01L 41/053 (2006.01); H01G 4/12 (2006.01); H01C 7/00 (2006.01); H01C 1/14 (2006.01); H05K 3/46 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H01C 1/14 (2013.01); H01C 7/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1227 (2013.01); H01G 4/1236 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01); H01L 41/0472 (2013.01); H01L 41/0477 (2013.01); H01L 41/053 (2013.01); H01L 41/1876 (2013.01); H05K 3/4697 (2013.01); H01F 17/00 (2013.01); H01F 27/292 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10636 (2013.01); Y02P 70/611 (2015.11);
Abstract

An electronic component includes an inner electrode inside of a main body and exposed at a surface of the main body, and an outer electrode on a surface of the main body and electrically connected to the inner electrode, wherein a plurality of recesses are provided in a surface of the outer electrode, and each of the plurality of recesses includes a portion in which a diameter of an opening of the recess gradually decreases toward an opening side of the recess.

Find Patent Forward Citations

Hirota, Masaki. (2018). Electronic component and electronic component built-in board (U.S. Patent No. 10085344). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10085344

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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