The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 25, 2018

Filed:

May. 26, 2016
Applicant:

Delta Electronics Int'l (Singapore) Pte Ltd, Singapore, SG;

Inventors:

Yiu-Wai Lai, Singapore, SG;

Da-Jung Chen, Singapore, SG;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02M 7/06 (2006.01); H01L 29/739 (2006.01); H01L 29/861 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/11 (2006.01); H01L 25/18 (2006.01); H02M 7/00 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H02M 7/5387 (2007.01);
U.S. Cl.
CPC ...
H02M 7/06 (2013.01); H01L 23/3114 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 24/18 (2013.01); H01L 25/112 (2013.01); H01L 25/18 (2013.01); H01L 29/7395 (2013.01); H01L 29/861 (2013.01); H01L 23/3735 (2013.01); H01L 23/49861 (2013.01); H02M 7/003 (2013.01); H02M 7/5387 (2013.01);
Abstract

A power module includes a substrate, a first sub-module and a second sub-module. Each of the first sub-module and the second sub-module includes a semiconductor switch and a diode. The first sub-module is formed as the high-voltage-side switching element. The second sub-module is formed as the low-voltage-side switching element. The plural electrodes of the high-voltage-side switching element and the plural electrodes of the low-voltage-side switching element are electrically connected with the conducting terminals of the corresponding semiconductor switches and the corresponding diodes. The high-voltage-side switching element is disposed on the substrate and electrically connected with the corresponding conducting parts of the substrate. The low-voltage-side switching element is disposed on the high-voltage-side switching element and electrically connected with the corresponding conducting parts of the substrate through the high-voltage-side switching element.


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Lai, Yiu-Wai. (2018). Power module (U.S. Patent No. 10084389). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10084389

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