The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 25, 2018

Filed:

Nov. 24, 2015
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Hsuan-Yu Lin, Changhua County, TW;

Hsin-Chu Chen, Miaoli County, TW;

Wen-Hong Liu, Taichung, TW;

Chao-Feng Sung, Hsinchu, TW;

Chun-Ting Liu, Hsinchu County, TW;

Je-Ping Hu, Hsinchu, TW;

Wen-Yung Yeh, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H01L 51/00 (2006.01); H01R 12/70 (2011.01); H01R 13/62 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0024 (2013.01); H01L 51/5203 (2013.01); H01L 51/5237 (2013.01); H01L 51/5246 (2013.01); H01R 12/7076 (2013.01); H01R 13/6205 (2013.01); H01L 51/56 (2013.01);
Abstract

An illumination device includes a substrate, a light emitting structure, a sealant, and a laminating board is provided. The light emitting structure includes a first electrode layer, a light emitting layer and a second electrode layer stacked on the substrate sequentially. The sealant covers the light emitting structure. The laminating board is attached to the substrate. The sealant is located between the laminating board and the substrate. The laminating board includes a carrier body, a metal layer and a plurality of pads. The metal layer is exposed at a first surface of the carrier body, is in contact with the sealant and shields an area of the light emitting layer of the light emitting structure. The pads are exposed at the first surface of the carrier body and electrically connected to the first electrode layer and the second electrode layer. The metal layer is electrically isolated from the pads.


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