The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 25, 2018

Filed:

Jul. 02, 2013
Applicant:

Skyworks Filter Solutions Japan Co., Ltd., Kadoma-Shi, JP;

Inventors:

Hidenori Uematsu, Osaka-Fu, JP;

Tomohiro Fujita, Osaka-Fu, JP;

Ichiro Kameyama, Osaka-Fu, JP;

Tetsuya Furihata, Osaka-Fu, JP;

Fuyuki Abe, Kyoto-Fu, JP;

Kazunori Nishimura, Kyoto-Fu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/053 (2006.01); H03H 9/10 (2006.01); H01L 41/047 (2006.01); H01L 41/107 (2006.01);
U.S. Cl.
CPC ...
H01L 41/053 (2013.01); H01L 41/047 (2013.01); H01L 41/107 (2013.01); H03H 9/1092 (2013.01);
Abstract

An electronic component includes a substrate a functional section provided on the substrate, and a sealing body which is provided on the substrate and seals the functional section. In a temperature region having a lowest temperature that is at least as high as the glass transition temperature of the sealing body, the coefficient of linear expansion of the sealing body is greater than the coefficient of linear expansion of the substrate. In a temperature region having a highest temperature that is lower than the glass transition temperature of the sealing body, the coefficient of linear expansion of the sealing body is less than the coefficient of linear expansion of the substrate. The electronic component exhibits superior reliability even upon prolonged use.


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