The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2018
Filed:
Mar. 24, 2017
Applicant:
Seoul Viosys Co., Ltd., Ansan-si, KR;
Inventors:
Kyung Wan Kim, Ansan-si, KR;
Tae Kyoon Kim, Ansan-si, KR;
Yeo Jin Yoon, Ansan-si, KR;
Ye Seul Kim, Ansan-si, KR;
Sang Hyun Oh, Ansan-si, KR;
Jin Woong Lee, Ansan-si, KR;
In Soo Kim, Ansan-si, KR;
Assignee:
Seoul Viosys Co., Ltd., Ansan-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/20 (2010.01); H01L 33/22 (2010.01); H01L 33/06 (2010.01); H01L 33/32 (2010.01); H01L 33/00 (2010.01); H01L 33/30 (2010.01);
U.S. Cl.
CPC ...
H01L 33/20 (2013.01); H01L 33/007 (2013.01); H01L 33/06 (2013.01); H01L 33/22 (2013.01); H01L 33/30 (2013.01); H01L 33/32 (2013.01);
Abstract
A method of fabricating a light emitting diode (LED) includes: sequentially stacking a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a substrate; and separating the substrate into unit chips, and at the same time, forming a concavo-convex structure having the shape of irregular vertical lines in a side surface of the unit chip.