The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2018
Filed:
Jan. 14, 2015
Applicant:
Ams Ag, Unterpremstaetten, AT;
Inventors:
Hubert Enichlmair, Weinitzen, AT;
Franz Schrank, Graz, AT;
Assignee:
AMS AG, Unterpremstaetten, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0232 (2014.01); H01L 27/146 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14625 (2013.01); H01L 23/481 (2013.01); H01L 27/14632 (2013.01); H01L 27/14636 (2013.01); H01L 27/14687 (2013.01);
Abstract
A sensor () is arranged at a main surface () of a semiconductor substrate (), and a filter () is arranged above the sensor. A through-substrate via () penetrates the substrate outside the region of the sensor. A semiconductor body is applied above the main surface and then partially removed at least in an area above the sensor. A portion of the semiconductor body remains above the through-substrate via as a frame layer (). The filter is on a level with the frame layer.