The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2018
Filed:
Dec. 16, 2016
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventors:
Mitsutaka Yamada, Atsugi, JP;
Masumi Suzuki, Kawasaki, JP;
Michimasa Aoki, Kawasaki, JP;
Jie Wei, Hachioji, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/46 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01); H01L 23/04 (2006.01); H01L 23/44 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/04 (2013.01); H01L 23/44 (2013.01); H01L 23/46 (2013.01); H01L 25/165 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06582 (2013.01); H01L 2225/06589 (2013.01);
Abstract
A semiconductor module includes: a container through which a refrigerant flows; a semiconductor device installed within the container and having an internal path through which the refrigerant flows; and a guide member installed within the container to adjust a first flow rate of the refrigerant flowing through the internal path, and a second flow rate of the refrigerant flowing outside the semiconductor device.