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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10083889 B1

PDFFull Text
Date of Patent:
Sep. 25, 2018

Filed:

May. 16, 2017

Electronic component package including sealing resin layer, metal member, ceramic substrate, and electronic component and method for manufacturing the same

Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Takashi Ichiryu, Osaka, JP;

Koji Kawakita, Nara, JP;

Masanori Nomura, Osaka, JP;

Assignee:

PANASONIC CORPORATION, Osaka, JP;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Jasmine Clark

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3121 (2013.01); H01L 21/4817 (2013.01); H01L 21/4853 (2013.01); H01L 21/52 (2013.01); H01L 23/293 (2013.01); H01L 23/4952 (2013.01); H01L 23/49548 (2013.01); H01L 23/49894 (2013.01); H01L 24/46 (2013.01); H01L 2224/48091 (2013.01);
Abstract

An electronic component package includes: a sealing resin layer; a metal member buried therein and including a die bond portion and a terminal electrode portion located outside the die bond portion; a ceramic substrate buried in the sealing resin layer; and an electronic component disposed on the die bond portion. When viewed in plan, the die bond portion and the ceramic substrate are partially overlapped to be in contact with each other, and the terminal electrode portion and the ceramic substrate are partially overlapped to be in contact with each other. The electronic component is electrically connected to the terminal electrode portion. The metal member includes a first plating layer and a second plating layer, and the average crystal grain diameter of the first plating layer is smaller than the average crystal grain diameter of the second plating layer.

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