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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10083850 B1

PDFFull Text
Expired
Date of Patent:
Sep. 25, 2018

Filed:

Jan. 12, 2017

Method of forming a flexible semiconductor layer and devices on a flexible carrier

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Stephen W. Bedell, Wappingers Falls, NY (US);

Devendra K. Sadana, Pleasantville, NY (US);

Katherine L. Saenger, Ossining, NY (US);

Abdelmajid Salhi, Riyadh, SA;

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorneys:

Harrington & Smith

Louis J. Percello

Primary Examiner:

Scott B Geyer

Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01);
Abstract

A method for fabricating a semiconductor device comprises providing a preformed spalled structure comprising a stressor layer stack on a first surface of a semiconductor substrate; forming an interfacial release layer on an exposed second surface of the semiconductor substrate; adhesively bonding the interfacial release layer to a rigid handle substrate using an epoxy; removing at least a portion of the stressor layer stack from the first surface of the semiconductor substrate; processing the semiconductor substrate; and removing the semiconductor substrate from the interfacial release layer to impart flexibility to the semiconductor substrate.

Find Patent Forward Citations

Bedell, Stephen. (2018). Method of forming a flexible semiconductor layer and devices on a flexible carrier (U.S. Patent No. 10083850). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10083850

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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