The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2018
Filed:
May. 03, 2016
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Young-Mi Na, Hwaseong-si, KR;
Min-Gu Kim, Yongin-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 1/44 (2006.01); G01R 1/073 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2862 (2013.01); G01R 31/2863 (2013.01); G01R 31/2875 (2013.01);
Abstract
A probe card includes a circuit substrate to transmit an electrical signal for testing a semiconductor device, a probe block on a lower surface of the circuit substrate, the probe block having a plurality of probes, and a thermal insulation cover assembly on an upper surface of the circuit substrate, the thermal insulation cover assembly covering at least a portion of the circuit substrate and defining a heat receiving space, the thermal insulation cover assembly retaining heat applied to the circuit substrate within the heat receiving space.