The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 25, 2018

Filed:

Sep. 30, 2013
Applicant:

President and Fellows of Harvard College, Cambridge, MA (US);

Inventors:

Samuel K. Sia, New York, NY (US);

Vincent Linder, Tewksbury, MA (US);

Babak Parviz, Mountain View, CA (US);

Adam Siegel, New York, NY (US);

George M. Whitesides, Newton, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 33/569 (2006.01); B01L 3/00 (2006.01); G01N 21/05 (2006.01); G01N 21/59 (2006.01); G01N 33/53 (2006.01); G01N 33/58 (2006.01); G01N 33/543 (2006.01); G01N 21/03 (2006.01);
U.S. Cl.
CPC ...
G01N 33/56988 (2013.01); B01L 3/502707 (2013.01); G01N 21/05 (2013.01); G01N 21/59 (2013.01); G01N 33/5302 (2013.01); G01N 33/543 (2013.01); G01N 33/585 (2013.01); B01L 2300/0822 (2013.01); B01L 2300/168 (2013.01); G01N 2021/0346 (2013.01); Y10T 436/11 (2015.01); Y10T 436/117497 (2015.01); Y10T 436/118339 (2015.01);
Abstract

An assay method is described, which comprises the steps of immobilizing a binding partner (e.g., an antigen or antibody) for an analyte to be detected (e.g., an antibody or antigen) on a portion of a surface of a microfluidic chamber; passing a fluid sample over the surface and allowing the analyte to bind to the binding partner; allowing a metal colloid, e.g., a gold-conjugated antibody, to associate with the bound analyte; flowing a metal solution, e.g., a silver solution, over the surface such as to form an opaque metallic layer; and detecting the presence of said metallic layer, e.g., by visual inspection or by measuring light transmission through the layer, conductivity or resistance of the layer, or metal concentration in the metal solution after flowing the metal solution over the surface.


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