The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 25, 2018

Filed:

Jan. 06, 2016
Applicant:

National Chiao Tung University, Hsinchu, TW;

Inventors:

Chi-Chuan Wang, Hsinchu County, TW;

Kuo-Wei Lin, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 13/18 (2006.01); H05K 7/20 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
F28F 13/187 (2013.01); H01L 23/473 (2013.01); H05K 7/20218 (2013.01); H05K 7/20254 (2013.01); F28F 2260/02 (2013.01);
Abstract

A heat conducting module includes a main body. The main body includes a first surface and a second surface. The first surface is thermally connected to a heat absorbing body. The second surface is opposite to the first surface and is fluidly connected to a channel. The second surface has a plurality of grooves disposed along a direction. The channel allows a fluid to flow a long the direction. Each of the grooves includes a first sub-groove and at least one second sub-groove. The first sub-groove at least has a third surface close to the first surface. The first sub-groove at least partially communicates with the second sub-groove, and the second sub-groove is at least partially fluidly connected with the third surface.


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