The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2018
Filed:
Jul. 25, 2016
Applicant:
Fuji Xerox Co., Ltd., Tokyo, JP;
Inventors:
Sakae Takeuchi, Kanagawa, JP;
Hiroyoshi Okuno, Kanagawa, JP;
Satoshi Inoue, Kanagawa, JP;
Yoshifumi Iida, Kanagawa, JP;
Tomohito Nakajima, Kanagawa, JP;
Yuka Zenitani, Kanagawa, JP;
Yoshifumi Eri, Kanagawa, JP;
Yasuo Kadokura, Kanagawa, JP;
Takeshi Iwanaga, Kanagawa, JP;
Shunsuke Nozaki, Tokyo, JP;
Yasuhisa Morooka, Kanagawa, JP;
Assignee:
FUJI XEROX CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08K 3/36 (2006.01); C08K 3/013 (2018.01); C08K 9/08 (2006.01); C08K 3/00 (2018.01); C08K 3/22 (2006.01); B29B 7/00 (2006.01); C08K 3/24 (2006.01);
U.S. Cl.
CPC ...
C08K 3/36 (2013.01); C08K 3/0033 (2013.01); C08K 3/013 (2018.01); C08K 9/08 (2013.01); B29B 7/005 (2013.01); C08K 3/24 (2013.01); C08K 2003/2213 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/003 (2013.01); C08K 2201/016 (2013.01);
Abstract
A resin particle composition includes resin particles, polishing agent particles having an average circle-equivalent diameter of 0.1 μm to 3.0 μm, and silica particles having a compression aggregation degree of 60% to 95% and a particle compression ratio of 0.20 to 0.40.