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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10081585 B1

PDFFull Text
Date of Patent:
Sep. 25, 2018

Filed:

Feb. 21, 2014

Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board

Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Yutaka Satou, Ichihara, JP;

Ayumi Takahashi, Ichihara, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorneys:

Locke Lord LLP

James E. Armstrong, IV

Nicholas J. DiCeglie, Jr.

Primary Examiner:

Duc Truong

Int. Cl.
CPC ...
C07C 39/14 (2006.01); C07C 37/14 (2006.01); H01L 23/29 (2006.01); C08G 61/02 (2006.01); C08G 8/02 (2006.01); C08L 61/16 (2006.01); C08K 3/04 (2006.01); C08K 7/18 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); C08G 59/62 (2006.01); C08L 63/00 (2006.01); C08L 91/06 (2006.01); C07C 37/00 (2006.01); C08L 65/00 (2006.01);
U.S. Cl.
CPC ...
C07C 39/14 (2013.01); C07C 37/14 (2013.01); C08G 8/02 (2013.01); C08G 59/621 (2013.01); C08G 61/02 (2013.01); C08K 3/04 (2013.01); C08K 7/18 (2013.01); C08L 61/16 (2013.01); C08L 63/00 (2013.01); C08L 91/06 (2013.01); H01L 23/293 (2013.01); H01L 23/295 (2013.01); H05K 1/0373 (2013.01); H05K 1/09 (2013.01); C08L 65/00 (2013.01); H01L 2924/0002 (2013.01);
Abstract

There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The compound containing a phenolic hydroxyl group has a molecular structure represented by the following General Formula (I): wherein X is a structural site represented by the following Structural Formula (x1) or (x2); wherein, in Formula (x1) or (x2), k is an integer of 1 to 3, m is 1 or 2, Ar is a structural site represented by the following Structural Formula (Ar1), and in a case where when k or m is 2 or greater, a plurality of Ar's may be the same as or different from each other; wherein r is 1 or 2.

Find Patent Forward Citations

Satou, Yutaka. (2018). Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board (U.S. Patent No. 10081585). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10081585

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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