The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2018
Filed:
Jan. 20, 2016
Seiko Epson Corporation, Tokyo, JP;
Masashi Yoshiike, Chino, JP;
Tomoyoshi Saito, Chino, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
A manufacturing method of an electronic device includes a first stacking process of forming a first photosensitive adhesive on a surface on a second substrate side in a first substrate; and a second stacking process of forming a second photosensitive adhesive, which overlaps the first photosensitive adhesive, having a lower degree of cure than that of the first photosensitive adhesive; and a bonding process of bonding together the first substrate and the second substrate by curing the second photosensitive adhesive by heating, in a state in which the first photosensitive adhesive and the second photosensitive adhesive are interposed between the first substrate and the second substrate.