The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 25, 2018

Filed:

Jun. 29, 2017
Applicant:

Nikon Corporation, Tokyo, JP;

Inventor:

Hideaki Hara, Kumagaya, JP;

Assignee:

NIKON CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03B 27/32 (2006.01); B25J 11/00 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); G03F 7/20 (2006.01); B25J 15/06 (2006.01);
U.S. Cl.
CPC ...
B25J 11/0095 (2013.01); B25J 15/0616 (2013.01); G03F 7/7075 (2013.01); G03F 7/70716 (2013.01); G03F 7/70783 (2013.01); H01L 21/67259 (2013.01); H01L 21/67288 (2013.01); H01L 21/681 (2013.01); H01L 21/6838 (2013.01); H01L 21/68778 (2013.01);
Abstract

A carrier system is provided with a wafer stage which holds a mounted wafer and is also movable along an XY plane, a chuck unit which holds the wafer from above in a non-contact manner above a predetermined position and is vertically movable, and a plurality of vertical movement pins, which can support from below the wafer held by the chuck unit on the wafer stage when the wafer stage is positioned at the predetermined position above and can also move vertically. Then, flatness of the wafer is measured by a Z position detection system, and based on the measurement results, the chuck unit and the vertical movement pins that hold (support) the wafer are independently driven.


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