The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2018

Filed:

Apr. 30, 2014
Applicant:

Sumida Electric (H.k.) Company Limited, Hong Kong, CN;

Inventors:

Zhuo Wu, Hong Kong, CN;

Douglas James Malcolm, Algonquin, IL (US);

Yanfei Liu, Kingston, CA;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H05K 3/32 (2006.01); H01F 27/40 (2006.01); H01F 27/29 (2006.01); H01F 17/04 (2006.01);
U.S. Cl.
CPC ...
H05K 3/32 (2013.01); H01F 27/292 (2013.01); H01F 27/40 (2013.01); H01F 2017/048 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/49147 (2015.01);
Abstract

A power supply module and a method for manufacturing the same are disclosed. The power supply module includes: a coil including a coil body and a connecting terminal; electronic components at least including an integrated circuit chip; a connector configured to be electrically connected with the coil and the electronic component; and a magnetic conductor configured to enclose in and around the coil body and the electronic component, wherein the connector is integrally formed with the integrated circuit chip when manufacturing the latter. The present disclosure can make the structure of the power supply module be more compact to further meet the needs of miniaturization design, reduce material consumption, simplify procedure, and therefore reduce the production costs.


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