The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2018
Filed:
Nov. 12, 2015
Micronas Gmbh, Freiburg, DE;
Thilo Rubehn, Gundelfingen, DE;
TDK-Micronas GmbH, Freiburg, DE;
Abstract
A circuit package having a first semiconductor body with a first monolithic integrated circuit having a first signal output that is interconnected with a bonding surface, and a first signal input that is interconnected with a bonding surface. The circuit package also has a second semiconductor body with a second monolithic integrated circuit having a second signal output that is interconnected with a bonding surface, and a second signal input that is interconnected with a bonding surface. The circuit package further features a contact element with at least one bonding surface, and a carrier element, wherein the bonding surface of the first signal output and the bonding surface of the second signal input are interconnected with the contact element so that an electrical connection exists between the first signal output and the second signal input, and a portion of the contact element penetrates the circuit package.