The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2018
Filed:
Feb. 15, 2012
Applicant:
Hiroyuki Waku, Tokyo, JP;
Inventor:
Hiroyuki Waku, Tokyo, JP;
Assignee:
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); B29C 70/88 (2006.01); B64C 3/20 (2006.01); B64C 3/26 (2006.01); B64D 45/02 (2006.01); H05K 13/00 (2006.01); B64C 3/18 (2006.01); B29K 307/04 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); B29C 70/882 (2013.01); B64C 3/18 (2013.01); B64C 3/20 (2013.01); B64C 3/26 (2013.01); B64D 45/02 (2013.01); H05K 13/00 (2013.01); B29K 2307/04 (2013.01); H05K 1/0366 (2013.01); H05K 3/4602 (2013.01); H05K 3/4632 (2013.01); H05K 2201/029 (2013.01); H05K 2201/0323 (2013.01); H05K 2201/10363 (2013.01); Y02T 50/43 (2013.01); Y10T 29/49117 (2015.01);
Abstract
A spar includes a conductive layer laminated and formed on a carbon-fiber prepreg, and a jumper formed of a conductor which penetrates through the conductive layer and the carbon-fiber prepreg.