The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2018

Filed:

May. 08, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Bruce J. Chamberlin, Vestal, NY (US);

Scott B. King, Rochester, MN (US);

Joseph Kuczynski, North Port, FL (US);

David J. Russell, Owego, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0293 (2013.01); H05K 1/0201 (2013.01); H05K 1/11 (2013.01); H05K 1/181 (2013.01); H05K 1/16 (2013.01); H05K 1/18 (2013.01); H05K 1/182 (2013.01); H05K 1/186 (2013.01); H05K 2201/0308 (2013.01);
Abstract

An apparatus is provided with a component configured with an interface comprising a resilient material. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to the temperature that meets or exceeds the transition temperature of interface causes the resilient material to undergo a state change. The state change of the interface alters the position of the component, including separation of the component from the substrate. The separation disrupts the attachment thereby mitigating damage to the substrate and/or component.


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