The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2018

Filed:

Nov. 13, 2015
Applicant:

Samsung Display Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Younhwan Jung, Hwaseong-si, KR;

Minseop Kim, Cheonan-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); G02F 1/13 (2006.01); H05K 1/14 (2006.01); H01L 51/00 (2006.01); G02F 1/1345 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); G02F 1/13452 (2013.01); H01L 51/0097 (2013.01); H05K 1/147 (2013.01); G02F 2202/28 (2013.01); H01L 2251/5338 (2013.01); H05K 2201/10128 (2013.01); Y02E 10/549 (2013.01); Y02P 70/521 (2015.11);
Abstract

A display apparatus includes a display panel, a panel adhesive film on the display panel, a main printed circuit board, and a flexible printed circuit board. The main printed circuit board is adhered to the panel adhesive film in an assembled state. The flexible printed circuit board electrically connects the display panel to the main printed circuit board. The flexible printed circuit board includes a base film, an integrated circuit chip, and a FPCB adhesive film. The base film has a bonding area that is bonded to the display panel and the main printed circuit board and a non-bonding area that is not bonded to the display panel and the main printed circuit board. The FPCB adhesive film is on the base film and overlaps with the non-bonding area. The FPCB adhesive film and the panel adhesive film are adhered to each other in the assembled state.


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