The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2018

Filed:

Apr. 25, 2013
Applicant:

Kyocera Corporation, Kyoto, JP;

Inventors:

Toshihisa Nabata, Zama, JP;

Satoshi Mizuta, Sagamihara, JP;

Tomoaki Miyano, Kameyama, JP;

Kiyokazu Sato, Yokohama, JP;

Akio Kihara, Yokohama, JP;

Shun Kazama, Yokohama, JP;

Yasuhiro Katayama, Yokohama, JP;

Assignee:

KYOCERA Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04M 1/02 (2006.01); H04M 19/04 (2006.01); H04M 1/03 (2006.01); H04B 1/3888 (2015.01); H04R 1/02 (2006.01); H04R 7/04 (2006.01); H04M 1/18 (2006.01); H04R 1/28 (2006.01); H04R 17/00 (2006.01);
U.S. Cl.
CPC ...
H04M 1/03 (2013.01); H04B 1/3888 (2013.01); H04M 1/0202 (2013.01); H04M 1/026 (2013.01); H04M 19/047 (2013.01); H04R 1/023 (2013.01); H04R 7/045 (2013.01); H04M 1/0214 (2013.01); H04M 1/185 (2013.01); H04R 1/2892 (2013.01); H04R 17/00 (2013.01); H04R 2400/03 (2013.01); H04R 2440/05 (2013.01); H04R 2460/13 (2013.01); H04R 2499/11 (2013.01);
Abstract

Provided is an electronic device that can be appropriately used as a type of electronic device that vibrates a panel attached to a housing. The electronic device includes a piezoelectric element, a panel, to which the piezoelectric element is attached, that vibrates due to the piezoelectric element to generate a vibration sound transmitted by vibrating a part of a human body, a housing supporting the panel with a first face, a microphone contained within the housing and disposed on a second face, and a buffer that damps vibration transmitted from the panel to the microphone through the first face and/or the second face, thereby reducing noise picked up by the microphone.


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