The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2018
Filed:
Jul. 28, 2017
Applicant:
Furukawa Electric Co., Ltd., Tokyo, JP;
Inventors:
Tetsuya Mieda, Tokyo, JP;
Takumi Asanuma, Tokyo, JP;
Yasushi Ishizaka, Tokyo, JP;
Keiji Saito, Tokyo, JP;
Assignee:
FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H01L 23/29 (2006.01); H05B 33/04 (2006.01); H01L 23/31 (2006.01); C09K 3/10 (2006.01); B01J 20/22 (2006.01); B01D 53/28 (2006.01);
U.S. Cl.
CPC ...
H01L 51/524 (2013.01); B01D 53/28 (2013.01); B01J 20/223 (2013.01); C09K 3/10 (2013.01); H01L 23/29 (2013.01); H01L 23/31 (2013.01); H01L 51/5259 (2013.01); H05B 33/04 (2013.01);
Abstract
An electronic-device-sealing resin composition and an organic EL element, having, as a crosslinkable organometallic desiccant, a metal complex compound having crosslinkable alkoxide represented by formula (1) as a ligand:M(OR)  Formula (1)