The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2018
Filed:
Jan. 13, 2016
Applicant:
Boe Technology Group Co., Ltd., Beijing, CN;
Inventors:
Yingying Song, Beijing, CN;
Li Sun, Beijing, CN;
Assignee:
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/08 (2006.01); H01L 21/00 (2006.01); H01L 27/32 (2006.01); H01L 25/065 (2006.01); H01L 29/786 (2006.01); H01L 51/00 (2006.01); H01L 51/50 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3246 (2013.01); H01L 25/0655 (2013.01); H01L 27/3258 (2013.01); H01L 27/3262 (2013.01); H01L 27/3276 (2013.01); H01L 29/786 (2013.01); H01L 51/0005 (2013.01); H01L 51/5012 (2013.01); H01L 51/56 (2013.01); H01L 2227/323 (2013.01); H05K 999/99 (2013.01);
Abstract
The present invention provides a substrate assembly comprising: a substrate; electrodes, metal wirings and TFTs formed on the substrate; and banks formed over the substrate, the banks enclosing pixel areas and exposing the electrodes; wherein a surface of the bank away from the substrate comprises one or more grooves, the grooves being adapted for collecting ink droplets remaining on the bank during subsequent inkjet printing process. The present invention further relates to a method for manufacturing a substrate assembly and a display device.