The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10079212 B1

Date of Patent:

Sep. 18, 2018

Filed:

Sep. 29, 2016

Semiconductor device having solder groove

Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventor:

Naoki Takizawa, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:

Primary Examiner:

Shouxiang Hu

Int. Cl.

CPC ...

H01L 23/538 (2006.01); H01L 23/48 (2006.01); H01L 23/492 (2006.01); H01L 23/498 (2006.01); H01L 23/15 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/482 (2006.01); H01L 23/373 (2006.01); H01L 25/18 (2006.01); H01L 29/16 (2006.01); H01L 29/739 (2006.01); H01L 29/861 (2006.01); H02M 7/5387 (2007.01); H01L 23/13 (2006.01); H02M 7/00 (2006.01);

U.S. Cl.

CPC ...

H01L 23/5386 (2013.01); H01L 23/13 (2013.01); H01L 23/15 (2013.01); H01L 23/3128 (2013.01); H01L 23/3735 (2013.01); H01L 23/48 (2013.01); H01L 23/4824 (2013.01); H01L 23/492 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 23/562 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/16 (2013.01); H01L 25/18 (2013.01); H01L 29/16 (2013.01); H01L 29/1608 (2013.01); H01L 29/7393 (2013.01); H01L 29/861 (2013.01); H02M 7/5387 (2013.01); H01L 2224/32225 (2013.01); H02M 7/003 (2013.01);

Abstract

In order to restrict cracking or the like in a connection member such as solder, provided is a semiconductor device including a first component; a second component that is arranged on a front surface of the first component; and a connection portion that is provided between the first component and the second component and connects the second component to the first component. A first groove and a second groove having different shapes are formed in the front surface of the first component at positions opposite a first corner and a second corner of the second component, and the connection portion is also formed within the first groove and the second groove.

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