The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2018

Filed:

Apr. 25, 2017
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Daniel Beckmeier, Unterhaching, DE;

Andreas Martin, Munich, DE;

Assignee:

INFINEON TECHNOLOGIES AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/10 (2006.01); H01L 21/66 (2006.01); G01R 31/28 (2006.01); G01R 31/26 (2014.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 22/34 (2013.01); G01R 31/2818 (2013.01); H01L 22/14 (2013.01); G01R 31/2621 (2013.01); G01R 31/2625 (2013.01); H01L 29/78 (2013.01);
Abstract

A semiconductor device includes a first test structure including a first portion of a conductive structure and a second portion of the conductive structure located within a first lateral wiring layer of a layer stack of the semiconductor device. The first portion of the conductive structure of the first test structure is electrically connected to the second portion of the conductive structure of the first test structure through a third portion located within a second lateral wiring layer of the layer stack arranged above the first lateral wiring layer. Further, the first portion of the conductive structure of the first test structure is electrically connected to a gate of a test transistor structure, a doping region of the test transistor structure or an electrode of a test capacitor. Additionally, the first portion of the conductive structure of the first test structure is electrically connected to a first test pad of the first test structure.


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