The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2018
Filed:
Feb. 16, 2017
Applicant:
Toshiba Memory Corporation, Tokyo, JP;
Inventors:
Assignee:
Toshiba Memory Corporation, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/3105 (2006.01); H01L 21/265 (2006.01); H01L 21/306 (2006.01); H01L 21/311 (2006.01); H01L 21/04 (2006.01); H01L 21/266 (2006.01); H01L 21/425 (2006.01); H01L 21/426 (2006.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31051 (2013.01); H01L 21/0465 (2013.01); H01L 21/266 (2013.01); H01L 21/2654 (2013.01); H01L 21/26506 (2013.01); H01L 21/30612 (2013.01); H01L 21/3105 (2013.01); H01L 21/31111 (2013.01); H01L 21/425 (2013.01); H01L 21/426 (2013.01); H01L 29/1608 (2013.01);
Abstract
In a substrate processing method according to the embodiment, a first material is implanted into a surface of a target film to modify the surface of the target film. The surface of the target film is dissolved to remove the surface of the target film by bringing a catalytic material close to the surface of the target film or by contacting the catalytic material to the surface of the target film while supplying a process solution on the surface of the target film which has been modified.