The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2018

Filed:

Jul. 15, 2015
Applicant:

Nantong Memtech Technologies Co., Ltd., Nantong, Jiangsu, CN;

Inventors:

Huisheng Han, Jiangsu, CN;

Zhenxing Wang, Jiangsu, CN;

Yang Ding, Jiangsu, CN;

Hongmei Zhang, Jiangsu, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01H 1/021 (2006.01); H01H 11/04 (2006.01); H01H 11/06 (2006.01); C23C 18/48 (2006.01); C25D 3/12 (2006.01); C25D 3/56 (2006.01); C23C 18/16 (2006.01); C23C 18/18 (2006.01); C23C 18/32 (2006.01); C23C 18/50 (2006.01); C23C 18/52 (2006.01); C25D 7/06 (2006.01); C25D 7/00 (2006.01);
U.S. Cl.
CPC ...
H01H 1/021 (2013.01); C23C 18/1633 (2013.01); C23C 18/1692 (2013.01); C23C 18/1806 (2013.01); C23C 18/1844 (2013.01); C23C 18/32 (2013.01); C23C 18/48 (2013.01); C23C 18/50 (2013.01); C23C 18/52 (2013.01); C25D 3/12 (2013.01); C25D 3/562 (2013.01); C25D 7/00 (2013.01); H01H 11/041 (2013.01); H01H 11/042 (2013.01); H01H 11/06 (2013.01); H01H 2011/046 (2013.01); H01H 2011/067 (2013.01);
Abstract

An arc-ablation resistant tungsten alloy switch contact and preparation method is disclosed. A contact member has a three-layer structure, wherein a first layer is a hydrophobic rubber layer, a second layer is a sheet metal layer, and a third layer is a tungsten alloy chemical deposition layer. A plating bath adopted in the chemical deposition contains 25-125 g/L soluble tungsten compound, 0-60 g/L soluble compound of a transition metal like ferrum, nickel, cobalt, copper or manganese, and 0-30 g/L soluble compound of tin, stibium, lead or bismuth. When a layered complex of the hydrophobic rubber layer and the sheet metal layer is chemically plated by the plating bath, a tungsten alloy plated layer is selectively deposited on a metal surface, and chemical deposition of the tungsten alloy does not occur on a surface of the hydrophobic rubber fundamentally.


Find Patent Forward Citations

Loading…