The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2018

Filed:

Oct. 27, 2017
Applicant:

David Lane Smith, Montgomery, TX (US);

Inventor:

David Lane Smith, Montgomery, TX (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); H05K 5/00 (2006.01); H05K 7/00 (2006.01); G11B 33/14 (2006.01); G11B 33/08 (2006.01); G06F 1/20 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G11B 33/1426 (2013.01); G06F 1/20 (2013.01); G11B 33/08 (2013.01); H05K 7/2039 (2013.01);
Abstract

A system and method for heat dissipation and vibration damping of electronic devices in which an assembly is formed by one or more surfaces comprised of at least one material that is a thermally conductive plastic that combines to partially or completely enclose one or more electronic devices as a physical and thermal intermediary between the electronic devices and supporting structures.


Find Patent Forward Citations

Smith, David. (2018). Thermally conductive and vibration damping electronic device enclosure and mounting (U.S. Patent No. 10079042). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10079042

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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