The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2018

Filed:

Jan. 20, 2017
Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventors:

Kotomi Suzuki, Kawasaki, JP;

Yuji Ichimura, Kawasaki, JP;

Yuko Nakamata, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C09J 163/00 (2006.01); C08L 79/08 (2006.01); C09J 179/08 (2006.01); C08L 79/04 (2006.01); C09J 179/04 (2006.01); C09J 11/04 (2006.01); H01L 23/29 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C08L 63/00 (2013.01); C08L 79/04 (2013.01); C08L 79/08 (2013.01); C09J 11/04 (2013.01); C09J 179/04 (2013.01); C09J 179/08 (2013.01); H01L 23/295 (2013.01); H01L 24/33 (2013.01); H01L 2224/3224 (2013.01); H01L 2924/186 (2013.01);
Abstract

A resin composition has a high glass transition temperature and is highly adhesive to a member made of metal, ceramics, or the like. The resin composition includes a thermosetting base resin, a thermoplastic resin powder, a curing agent, and an inorganic filler, a cured resin product formed by curing the resin composition, and an electrical member.


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