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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10077365 B1

PDFFull Text
Date of Patent:
Sep. 18, 2018

Filed:

Apr. 15, 2016

Liquid chemical for forming water repellent protecting film, and process for cleaning wafers using the same

Applicant:

Central Glass Company, Limited, Ube-shi, Yamaguchi, JP;

Inventors:

Soichi Kumon, Matsusaka, JP;

Takashi Saio, Suzuka, JP;

Masanori Saito, Matsusaka, JP;

Shinobu Arata, Matsusaka, JP;

Assignee:

Central Glass Company, Limited, Ube-shi, JP;

Attorney:

Crowell & Moring LLP

Primary Examiner:

Eric Wayne Golightly

Assistant Examiner:

Arlyn I Rivera-Cordero

Int. Cl.
CPC ...
C11D 1/00 (2006.01); C11D 1/04 (2006.01); C11D 1/34 (2006.01); C11D 1/40 (2006.01); C11D 1/58 (2006.01); C11D 3/20 (2006.01); C11D 3/28 (2006.01); C11D 3/34 (2006.01); C11D 3/36 (2006.01); C11D 3/43 (2006.01); C11D 3/00 (2006.01); H01L 21/02 (2006.01); H01L 21/321 (2006.01); B08B 7/00 (2006.01); B05D 1/18 (2006.01); C09D 5/20 (2006.01); C09D 5/00 (2006.01); C11D 11/00 (2006.01);
U.S. Cl.
CPC ...
C09D 5/00 (2013.01); C11D 1/004 (2013.01); C11D 1/006 (2013.01); C11D 1/04 (2013.01); C11D 1/342 (2013.01); C11D 1/40 (2013.01); C11D 1/58 (2013.01); C11D 3/2079 (2013.01); C11D 3/28 (2013.01); C11D 3/3427 (2013.01); C11D 3/361 (2013.01); C11D 3/43 (2013.01); C11D 11/0047 (2013.01); H01L 21/02068 (2013.01); H01L 21/02118 (2013.01); H01L 21/02282 (2013.01); H01L 21/321 (2013.01); H01L 21/02052 (2013.01); H01L 21/02093 (2013.01);
Abstract

A liquid chemical for forming a water repellent protecting film on a wafer having at its surface an uneven pattern and containing at least one kind of element selected from the group consisting of titanium, tungsten, aluminum, copper, tin, tantalum and ruthenium at surfaces of recessed portions of the uneven pattern, the water repellent protecting film being formed at least on the surfaces of the recessed portions. The liquid chemical is characterized by including: a water repellent protecting film forming agent; and water, and characterized in that the water repellent protecting film forming agent is at least one selected from compounds represented by the following general formula [1] and salt compounds thereof and that the concentration of the water relative to the total quantity of a solvent contained in the liquid chemical is not smaller than 50 mass %.

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