The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2018

Filed:

Jan. 21, 2016
Applicant:

Chinook Asia Llc, Lake Oswego, OR (US);

Inventor:

Robert Kent Scofield, Lake Oswego, OR (US);

Assignee:

Chinook Asia LLC, Lake Oswego, OR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 35/00 (2010.01); A43B 23/02 (2006.01); B29D 35/12 (2010.01);
U.S. Cl.
CPC ...
B29D 35/0009 (2013.01); A43B 23/0215 (2013.01); B29D 35/0027 (2013.01); B29D 35/126 (2013.01);
Abstract

Methods of and molds for manufacturing footwear are disclosed. In one example, the method may include forming at least one molded portion adjacent to at least one non-molded portion such that part of the at least one molded portion overlaps and contacts the at least one non-molded portion, and forming the at least one molded portion to include end portions that are adjacent the part of the at least one molded portion and that extend away from the at least one non-molded portion such that the end portions do not contact the at least one non-molded portion; moving the end portions of the at least one molded portion toward the at least one non-molded portion such that the end portions contact the at least one non-molded portion; and securing the end portions of the at least one molded portion to the at least one non-molded portion.


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