The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2018
Filed:
Nov. 23, 2017
Coretech System Co., Ltd., Chupei, Hsinchu County, TW;
Yuing Chang, Chupei, TW;
Rong-Yeu Chang, Chupei, TW;
Chia-Hsiang Hsu, Chupei, TW;
Chuan-Wei Chang, Chupei, TW;
Ching-Chang Chien, Chupei, TW;
CORETECH SYSTEM CO., LTD., Chupei, Hsinchu, TW;
Abstract
A molding system includes a molding machine, a mold disposed on the molding machine and having a mold cavity to be filled with a molding resin from the molding machine, and a computing apparatus connected to the molding machine. The computing apparatus is configured to perform operations for setting the molding machine to prepare a molding product, wherein the operations comprise: generating a first and a second state waveforms using a setting packing pressure profile; obtaining an updated packing pressure profile based on the first and the second state waveforms; and setting the molding machine based on the updated packing pressure profile to perform an actual molding process to prepare the molding product. The first and the second state waveforms express a relationship between an in-mold pressure and an in-mold temperature at different sensing sites of the molding resin.