The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2018

Filed:

Sep. 10, 2014
Applicant:

Husky Injection Molding Systems Ltd., Bolton, CA;

Inventor:

Edward Joseph Jenko, Essex, VT (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/27 (2006.01); B23P 15/00 (2006.01); B22F 3/105 (2006.01); B22F 5/00 (2006.01); B29C 33/38 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/278 (2013.01); B22F 3/1055 (2013.01); B22F 5/007 (2013.01); B23P 15/007 (2013.01); B29C 33/3842 (2013.01); B29C 45/2725 (2013.01); B29C 2045/2729 (2013.01); B29C 2045/2787 (2013.01); B29L 2031/757 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12);
Abstract

A unitary monolithically formed hot-runner apparatus having at least a manifold containment structure, a hot-runner manifold, at least one nozzle, and one or more spacers. In some embodiments, the manifold containment structure, hot-runner manifold, nozzle(s), and spacer(s) may be multi-material apparatuses of unitary monolithic construction. In other embodiments, a thermal expansion accommodation portion is provided for each nozzle to accommodate thermal growth. Each spacer may be formed of a material having a lower thermal conductivity than the materials of the hot-runner manifold and manifold containment structure and may be made to include a discontinuity to allow for thermal expansion.


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