The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2018
Filed:
Apr. 30, 2015
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventor:
Shogo Kawamura, Kawasaki, JP;
Assignee:
CANON KABUSHIKI KAISHA, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/00 (2006.01); B29C 45/02 (2006.01); B29C 45/16 (2006.01); B29C 45/26 (2006.01); B32B 3/26 (2006.01); B32B 3/30 (2006.01); B32B 27/08 (2006.01); B32B 27/38 (2006.01); B29K 63/00 (2006.01); B29C 45/14 (2006.01); B29C 33/00 (2006.01); B29K 105/16 (2006.01);
U.S. Cl.
CPC ...
B29C 45/02 (2013.01); B29C 45/16 (2013.01); B29C 45/2602 (2013.01); B29C 45/2624 (2013.01); B32B 3/266 (2013.01); B32B 3/30 (2013.01); B32B 27/08 (2013.01); B32B 27/38 (2013.01); B29C 33/0088 (2013.01); B29C 45/14467 (2013.01); B29K 2063/00 (2013.01); B29K 2105/16 (2013.01); Y10T 428/1352 (2015.01);
Abstract
Provided are a molding method for efficiently and accurately performing molding of a layered component made of a thermosetting resin by a simple mechanism, and molded articles. For this purpose, primary molding for molding a plurality of divided bodies and secondary molding for joining the plurality of divided bodies with one another are performed sequentially.