The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2018
Filed:
May. 12, 2014
Applicant:
Mankiewicz Gebr. & Co. Gmbh & Co. KG, Hamburg, DE;
Inventors:
Assignee:
MANKIEWICZ GEBR. & CO. GMBH & CO. KG, Hamburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 1/02 (2006.01); B63B 59/00 (2006.01); C09D 5/34 (2006.01); C08K 7/22 (2006.01); C09D 163/00 (2006.01); C23C 14/34 (2006.01); C09D 7/40 (2018.01); C08G 59/44 (2006.01); C08G 59/50 (2006.01); B05B 12/14 (2006.01); B05B 7/32 (2006.01);
U.S. Cl.
CPC ...
B05D 1/02 (2013.01); B63B 59/00 (2013.01); C08K 7/22 (2013.01); C09D 5/34 (2013.01); C09D 7/70 (2018.01); C09D 163/00 (2013.01); C23C 14/34 (2013.01); B05B 7/32 (2013.01); B05B 12/1418 (2013.01); C08G 59/44 (2013.01); C08G 59/50 (2013.01);
Abstract
A method of using a putty in a mechanical processing method includes dosing a binder component comprising at least one epoxy resin, dosing a hardener component comprising at least one NH-group-containing compound, mixing the binder component and the hardener component into a putty mass, and applying the putty mass on an undercoat. At least one of the binder component and the hardener component comprises synthetic hollow bodies so that the putty mass comprises 0.1 to 15 wt.-% of the synthetic hollow bodies relative to a total weight of the putty mass.