The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2018

Filed:

Apr. 26, 2016
Applicant:

Omnivision Technologies, Inc., Santa Clara, CA (US);

Inventors:

Tsung Wei Wan, Hsinchu, TW;

Ting-Yu Cheng, New Taipei, TW;

Wei-Ping Chen, New Taipei, TW;

Chuen-Yi Yin, New Taipei, TW;

Assignee:

OmniVision Technologies, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 7/00 (2011.01); H04N 5/232 (2006.01); H04N 5/225 (2006.01); G02B 13/00 (2006.01); G02B 9/10 (2006.01); B29C 43/18 (2006.01); B29C 43/02 (2006.01); B29D 11/00 (2006.01); A61B 1/05 (2006.01); A61B 1/00 (2006.01); G02B 5/20 (2006.01); B29K 63/00 (2006.01); B29K 105/20 (2006.01); B29K 701/00 (2006.01); B29K 709/08 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
H04N 5/23238 (2013.01); A61B 1/0011 (2013.01); A61B 1/00096 (2013.01); A61B 1/00186 (2013.01); A61B 1/051 (2013.01); B29C 43/021 (2013.01); B29C 43/18 (2013.01); B29D 11/00009 (2013.01); B29D 11/00307 (2013.01); G02B 9/10 (2013.01); G02B 13/006 (2013.01); G02B 13/0085 (2013.01); H04N 5/2253 (2013.01); H04N 5/2254 (2013.01); B29D 11/0073 (2013.01); B29K 2063/00 (2013.01); B29K 2105/20 (2013.01); B29K 2701/00 (2013.01); B29K 2709/08 (2013.01); B29L 2031/753 (2013.01); G02B 5/20 (2013.01); H04N 2005/2255 (2013.01);
Abstract

An ultra-small camera module with wide field of view includes (a) a wafer-level lens system for forming, on an image plane, an image of a wide field-of-view scene, wherein the wafer-level lens system includes (i) a distal planar surface positioned closest to the scene and no more than 2.5 millimeters away from the image plane in direction along optical axis of the wafer-level lens system, and (ii) a plurality of lens elements optically coupled in series along the optical axis, each of the lens elements having a curved surface, and (b) an image sensor mechanically coupled to the wafer-level lens system and including a rectangular array of photosensitive pixels, positioned at the image plane, for capturing the image, wherein cross section of the ultra-small camera module, orthogonal to the optical axis, is rectangular with side lengths no greater than 1.5 millimeters.


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