The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2018

Filed:

Aug. 08, 2016
Applicant:

Johnson Electric S.a., Murten, CH;

Inventors:

Chi Ping Sun, Hong Kong, CN;

Ken Wong, Hong Kong, CN;

Shing Hin Yeung, Hong Kong, CN;

Shu Juan Huang, Shen Zhen, CN;

Yun Long Jiang, Shen Zhen, CN;

Gang Qian, Hong Kong, CN;

Yue Li, Hong Kong, CN;

Bao Ting Liu, Shen Zhen, CN;

En Hui Wang, Shen Zhen, CN;

Fei Xin, Shen Zhen, CN;

Xiu Wen Yang, Shen Zhen, CN;

Li Sheng Liu, Shen Zhen, CN;

Yan Yun Cui, Shen Zhen, CN;

Assignee:

Johnson Electric S.A., Murten, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02P 6/16 (2016.01); H02P 6/20 (2016.01); H02K 11/215 (2016.01); H02P 7/295 (2016.01); H02P 6/30 (2016.01); H02P 7/03 (2016.01);
U.S. Cl.
CPC ...
H02P 6/16 (2013.01); H02K 11/215 (2016.01); H02P 6/20 (2013.01); H02P 6/30 (2016.02); H02P 7/05 (2016.02); H02P 7/295 (2013.01); H02P 2207/05 (2013.01);
Abstract

An integrated circuit, a motor component including the integrated circuit and an application device having the motor component are provided according to embodiments of the present disclosure. The integrated circuit includes a housing, an integrated circuit die arranged inside the housing and multiple pins extended out from the housing. The integrated circuit die has a conductive back plate and an electronic circuit arranged on the conductive back plate. The multiple pins include an input pin and an output pin, each of the multiple pins has a lead frame inside the housing. And the conductive back plate is fixed to the lead frame of at least one ungrounded pin of the multiple pins in a manner of electrical insulation, thereby avoiding an short circuit for the integrated circuit due to an electrical connection between the conductive back plate and the lead frame fixed to the conductive back plate.


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