The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2018

Filed:

Mar. 24, 2016
Applicant:

Nuvotronics, Inc, Radford, VA (US);

Inventors:

David W. Sherrer, Cary, NC (US);

John J. Fisher, Greenville, SC (US);

Assignee:

NUVOTRONICS, INC, Radford, VA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/06 (2006.01); H01P 5/18 (2006.01); H01P 1/08 (2006.01); H01P 5/103 (2006.01); H01P 11/00 (2006.01); H05K 1/02 (2006.01); H01P 3/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01P 3/06 (2013.01); H01P 1/08 (2013.01); H01P 3/00 (2013.01); H01P 5/103 (2013.01); H01P 5/183 (2013.01); H01P 11/002 (2013.01); H01P 11/003 (2013.01); H01P 11/005 (2013.01); H05K 1/0221 (2013.01); H05K 1/0272 (2013.01); H05K 3/4644 (2013.01); H05K 3/4685 (2013.01); H05K 2201/09809 (2013.01); Y10T 29/49117 (2015.01); Y10T 29/49123 (2015.01);
Abstract

Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.


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