The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2018

Filed:

Dec. 22, 2014
Applicant:

Industrial Technology Research Institute, Chutung, Hsinchu County, TW;

Inventors:

Yueh-Chuan Huang, Chutung, TW;

Chyi-Ming Leu, Chutung, TW;

Assignee:

Industrial Technology Research Institute, Chutung, Hsinchu County, Taiwan, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/30 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0097 (2013.01); B32B 27/08 (2013.01); B32B 3/30 (2013.01); B32B 2457/206 (2013.01); H01L 2251/5338 (2013.01); Y02E 10/549 (2013.01);
Abstract

The present disclosure provides a substrate structure for an electronic element, which includes a supporting carrier; a release layer having a first microstructure on a surface thereof, and the release layer having first adhesion to the supporting carrier; and a flexible substrate for disposing the supporting carrier and the release layer thereon, wherein the flexible substrate has second adhesion to the release layer, the first adhesion is greater than the second adhesion, and the surface of the flexible substrate in contact with the surface of the release layer has a second microstructure opposing to the first microstructure. The present disclosure further provides a method for fabricating the substrate structure.


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