The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
Dec. 04, 2014
Applicant:
Samsung Medison Co., Ltd., Hongcheon-gun, Gangwon-do, KR;
Inventors:
Assignee:
SAMSUNG MEDISON CO., LTD., Gangwon-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/314 (2013.01); H01L 41/18 (2006.01); H01L 41/047 (2006.01); H01L 41/332 (2013.01); H01L 41/319 (2013.01); H01L 41/317 (2013.01); H01L 41/37 (2013.01); B06B 1/06 (2006.01);
U.S. Cl.
CPC ...
H01L 41/314 (2013.01); H01L 41/0471 (2013.01); H01L 41/183 (2013.01); H01L 41/317 (2013.01); H01L 41/319 (2013.01); H01L 41/332 (2013.01); H01L 41/37 (2013.01); B06B 1/064 (2013.01); B06B 1/0622 (2013.01); B06B 1/0629 (2013.01); Y10T 29/42 (2015.01); Y10T 156/11 (2015.01);
Abstract
Provided is a method of manufacturing an ultrasonic probe. The method includes forming a sacrificial layer on a substrate; forming a plurality of openings in the sacrificial layer that are separated from one another; forming piezoelectric units by growing a piezoelectric element in each of the plurality of openings; and removing the sacrificial layer.