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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10074788 B1

PDFFull Text
Date of Patent:
Sep. 11, 2018

Filed:

Oct. 24, 2017

Light emitting device package, backlight unit, illumination apparatus, and method of manufacturing light emitting device package

Applicant:

Lumens Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Seung-Hyun Oh, Gwangju-si, KR;

Sung-Sik Jo, Yongin-si, KR;

Jung-A Lim, Seoul, KR;

Sung-Yole Yun, Yongin-si, KR;

Ji-Yeon Lee, Yongin-si, KR;

Bo-Young Kim, Seoul, KR;

Assignee:

LUMENS CO., LTD., Yongin-si, KR;

Attorney:

Mei & Mark LLP

Primary Examiner:

Ngan Ngo

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 33/46 (2010.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01); H01L 33/60 (2010.01); H01L 23/00 (2006.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 33/46 (2013.01); H01L 33/486 (2013.01); H01L 33/50 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 24/30 (2013.01); H01L 2224/27312 (2013.01); H01L 2224/29015 (2013.01); H01L 2224/29019 (2013.01); H01L 2224/3015 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83385 (2013.01); H01L 2924/15156 (2013.01); H01L 2933/0066 (2013.01); H05K 999/99 (2013.01);
Abstract

Disclosed herein are a light emitting device package, a backlight unit, an illumination apparatus, and a method of manufacturing a light emitting device package capable of being used for a display application or an illumination application. The light emitting device package includes: a flip-chip type light emitting device having a first terminal and a second terminal installed therebeneath; a substrate having a first electrode formed at one side of an electrode separating space and a second electrode formed at the other side thereof; a first conductive bonding member installed on the first electrode of the substrate so as to be electrically connected to the first terminal of the light emitting device; a second conductive bonding member installed on the second electrode of the substrate so as to be electrically connected to the second terminal of the light emitting device; a reflection encapsulant molded and installed on the substrate so as to form a reflection cup part reflecting light generated in the light emitting device and filled in the electrode separating space to form an electrode separating part; and a filler filled between the reflection cup part and the first and second conductive bonding members.

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