The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2018

Filed:

Jul. 07, 2017
Applicant:

Nichia Corporation, Anan-shi, JP;

Inventor:

Koji Abe, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/54 (2010.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A package for mounting a light emitting element includes a pair of lead electrodes and a resin molded body. The pair of lead electrodes are made of metal plates. The package has a recess portion in which a light emitting element is mounted. The recess portion is formed of the pair of lead electrodes and the resin molded body. The pair of lead electrodes are exposed on a bottom surface of the recess portion. At least one of the pair of lead electrodes has a groove portion that is formed along a periphery of the metal plate exposed on the bottom surface of the recess portion. The periphery of the at least one of the pair of lead electrodes on the bottom surface of the recess portion constitutes a boundary between the bottom surface of the recess portion and a side surface portion of the recess portion.


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