Method for producing semiconductor components and semiconductor component

Abstract

A method for producing a plurality of semiconductor components () is provided, comprising the following steps: a) providing a semiconductor layer sequence () having a first semiconductor layer (), a second semiconductor layer () and an active region (), said active region being arranged between the first semiconductor layer and the second semiconductor layer for generating and/or receiving radiation; b) forming a first connection layer () on the side of the second connection layer facing away from the first semiconductor layer; c) forming a plurality of cut-outs () through the semiconductor layer sequence; d) forming a conducting layer () in the cut-outs for establishing an electrically conductive connection between the first semiconductor layer and the first connection layer; and e) separating into the plurality of semiconductor components, wherein a semiconductor body () having at least one of the plurality of cut-outs arises from the semiconductor layer sequence for each semiconductor component and the at least one cut-out is completely surrounded by the semiconductor body in a top view of the semiconductor body. Furthermore, a semiconductor component is provided.