The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
Sep. 22, 2016
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/304 (2006.01); H01L 29/205 (2006.01); H01L 29/20 (2006.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01); H01L 21/762 (2006.01); H01L 29/778 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/205 (2013.01); H01L 21/0254 (2013.01); H01L 21/304 (2013.01); H01L 21/31053 (2013.01); H01L 21/31056 (2013.01); H01L 21/76229 (2013.01); H01L 29/2003 (2013.01); H01L 21/02378 (2013.01); H01L 21/02381 (2013.01); H01L 21/02433 (2013.01); H01L 29/66462 (2013.01); H01L 29/778 (2013.01);
Abstract
In an embodiment, a method of planarizing a surface includes applying a first layer to a surface including a protruding region such that the first layer covers the surface and the protruding region, removing a portion of the first layer above the protruding region and forming an indentation in the first layer above the protruding region, the protruding region remaining covered by material of the first layer, and progressively removing an outermost surface of the first layer to produce a planarised surface.