The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2018

Filed:

Dec. 30, 2016
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Barry Jon Male, West Granby, CT (US);

Benjamin Cook, Addison, TX (US);

Robert Alan Neidorff, Bedford, NH (US);

Steve Kummerl, Carrolton, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01F 38/14 (2006.01); H01L 23/31 (2006.01); H01L 23/49 (2006.01); H01L 23/495 (2006.01); H01L 49/02 (2006.01); H01L 31/02 (2006.01); H01L 31/103 (2006.01); H01L 31/11 (2006.01); H01L 31/167 (2006.01); H01L 33/62 (2010.01); H04B 10/80 (2013.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01F 38/14 (2013.01); H01L 23/315 (2013.01); H01L 23/49 (2013.01); H01L 23/49575 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 28/10 (2013.01); H01L 31/02005 (2013.01); H01L 31/103 (2013.01); H01L 31/1105 (2013.01); H01L 31/167 (2013.01); H01L 33/62 (2013.01); H04B 10/803 (2013.01); H01L 24/08 (2013.01); H01L 2224/08113 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48245 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12043 (2013.01);
Abstract

Disclosed examples include integrated circuits with a leadframe structure, a first circuit structure including a light source configured to generate a light signal along an optical path, a second circuit structure including a light sensor facing the optical path to receive the light signal, and a molded package structure enclosing portions of the leadframe structure, the molded package structure having a cavity defined by an interior surface of the molded package structure, the optical path extending in the cavity between the first and second circuit structures.


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